Coverage closed · The live desk
Taiwan breaks ground on TSMC-linked advanced-packaging park in Kaohsiung
This coverage is closed. Last update
Baipu park enters construction with testing and training facilities planned
Taiwan broke ground September 21 on the 88.7-hectare Baipu Industrial Park in Kaohsiung. TSMC plans a technology-validation laboratory and talent-training centre there, with operations expected in the fourth quarter of 2029. About 53.6 hectares—roughly 60% of the site—are designated for industrial use. The park is intended to help equipment and materials suppliers test advanced-packaging technologies near related development work; it is not a new commercial chip-production plant.
Reuters: Taiwan breaks ground on advanced packaging park anchored by TSMC · 總統出席白埔產業園區動土典禮 完善南部半導體生態系 盼共同努力確保未來百年競爭優勢 · 白埔產業園區 全臺首座先進封裝產業園區動土 內政部攜手高雄 推動土地取得、完善基礎建設